With the development of led chip technology and market demands of higher brightness led, various types of encapsulation products were produced. From the earlier patch lamp-LED component, SMD type printed circuit board(PCB)structure, poly phthalate two amide (PPA), polyethylene terephthalate (PCT) and thermosetting epoxy resin (EMC) LED device structure to chip the aluminum nitride ceramic structure, high power integrated board package (Chip-On-Board, COB), various kinds of flip chip such different shape encapsulations (packaging),etc. The process of the led form like the following diagram shows,
Whether the high power led or the low power chip components, which eventually go embarked on the road of integration.
The future LED package will focus on lighting applications, mainly towards high power led, miniaturization, multi chip integration, high efficiency and high reliability direction. In order to enhance the lumens of white LED devices cost efficiency, solve working conditions of large current and high power package under the heat, realize high efficiency and high reliability technology, those will become a new theme.